NEW プライム上場 電子部品メーカー Test Data Analysis Engineer (E)

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勤務地	東京都小平市
仕事内容	By using statistical analysis methods and ML/AI analysis methods such as BigData analysis of test data of semiconductor products, we can extract issues hidden in the production process to improve yield and test efficiency.*The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process. Company Description Wafer prices for advanced processes are high, and the cost impact of manufacturing yield is very large. To improve yield, it is important to investigate the root causes of failures and improve manufacturing processes and mass production testing. This company identifies factors based on test data through advanced data analysis that combines manufacturing process, design information, and mass production test environment, and then uses software failure diagnosis and hard wafer analysis to investigate the root cause, leading to yield improvement. However, the level of difficulty in analyzing cutting-edge processes (3nm) is increasing, so we will strengthen our human resources for the development of advanced data analysis technology.
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企業データ	会社名 プライム上場 電子部品メーカー 事業内容 電子部品の研究開発・設計・製造・販売
Recruiting No.	02008321000360